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Zebronics H61 Motherboard ATX Intel LGA 1155 Socket | 6USB,1VGA,1LAN,1Audio,1HDMI Port, DDR3

Brand	ZEBRONICS
CPU Socket	LGA 1155
Compatible Devices	Mouse
RAM Memory Technology	DDR3
Compatible Processors	2nd Gen & 3rd Gen

₹2,199.00

Product Description

Product description

Processor support : Supports Intel i7/i5/i3/Pentium/Celeron processors in LGA1155 Chipset : Intel H61Chipset Memory support : 2 DDR3 dual-channel slots, Support DDR3 1066/1333/1600MHz memory LAN : Supports Realtek 8105E/8111E 100/1000 Mbps Audio : Realtek 662 3xAudio Jacks for 6 channel High definition audio Back panel : 1 PS/2 mouse/keyboard port, 1 VGA port, 1HDMI port, 4 USB 2.0 ports, 1 LAN port, 3 audio jacks On-Board connectors : 1 x Front panel connector, 1 x speaker connector, 1 x Front panel audio connector (2 x 5pin), 4 x USB 2.0 ports, 4 x SATA 3Gb/s (SATAII) ports, 1 x 4pin CPU fan connector, 1 x SYS fan connector, 1 x 24-pin ATX power connector, 1 x 4-pin ATX 12V power connector, 1 x 3pin clear CMOS header Slots : 1 PCI Express x16 slot, 1 PCI Express x1 slot

Brand	‎ZEBRONICS
Manufacturer	‎zebronics
Model	‎Zeb-H61
Product Dimensions	‎27 x 22 x 6 cm; 550 Grams
Item model number	‎Zeb-H61
Memory Storage Capacity	‎16 GB
RAM memory maximum size	‎16 GB
Ram Memory Technology	‎DDR3
Processor Type	‎Pentium
Processor Socket	‎LGA 1155
Compatible Processor Types	‎2nd Gen & 3rd Gen
Graphics Card Interface	‎PCI-Express x16
Compatible Devices	‎Mouse
Chipset Type	‎Intel H61 Express
Total USB ports	‎6
Manufacturer	‎Zebronics
Country of Origin	‎China
Item Weight	‎550 g

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Settings Zebronics H61 Motherboard ATX Intel LGA 1155 Socket | 6USB,1VGA,1LAN,1Audio,1HDMI Port, DDR3 remove Samsung 970 EVO Plus 500GB PCIe NVMe M.2 (2280) Internal Solid State Drive (SSD) remove GIGABYTE B760M DS3H AX DDR4 (LGA 1700/ Intel/ B760/ M-ATX/ DDR4/ 2* M.2/ PCIe 4.0/ USB 3.2 Gen 2 Type-C/WiFi 6E/ 2.5GbE LAN/Q-Flash Plus/PCIe EZ-Latch/Gaming Motherboard remove Crucial P3 500GB PCIe 3.0 3D NAND NVMe M.2 SSD, up to 3500MB/s remove Gigabyte GA-H110M-H DDR3 Intel H110 LGA1151 Micro ATX Motherboard remove TP-Link AC1200 Wireless WiFi PCLE Card | 2.4G/5G Dual Band Wi-Fi PCI Express Adapter | Low Profile, Long Range Beamforming Heat Sink Technology | Supports Windows 10/8.1/8/7/XP (Archer T4E) (Black) remove

Name Zebronics H61 Motherboard ATX Intel LGA 1155 Socket | 6USB,1VGA,1LAN,1Audio,1HDMI Port, DDR3 remove Samsung 970 EVO Plus 500GB PCIe NVMe M.2 (2280) Internal Solid State Drive (SSD) remove GIGABYTE B760M DS3H AX DDR4 (LGA 1700/ Intel/ B760/ M-ATX/ DDR4/ 2* M.2/ PCIe 4.0/ USB 3.2 Gen 2 Type-C/WiFi 6E/ 2.5GbE LAN/Q-Flash Plus/PCIe EZ-Latch/Gaming Motherboard remove Crucial P3 500GB PCIe 3.0 3D NAND NVMe M.2 SSD, up to 3500MB/s remove Gigabyte GA-H110M-H DDR3 Intel H110 LGA1151 Micro ATX Motherboard remove TP-Link AC1200 Wireless WiFi PCLE Card | 2.4G/5G Dual Band Wi-Fi PCI Express Adapter | Low Profile, Long Range Beamforming Heat Sink Technology | Supports Windows 10/8.1/8/7/XP (Archer T4E) (Black) remove

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Description

Brand	ZEBRONICS
CPU Socket	LGA 1155
Compatible Devices	Mouse
RAM Memory Technology	DDR3
Compatible Processors	2nd Gen & 3rd Gen

About this item

Performance: Sequential Read/Write speeds up to 3,500/3,300 MB/s respectively. Performance varies based on system hardware and configuration
Interface :NVMe (PCIe Gen 3.0 x 4). Voltage:3.3 V ± 5 % Allowable voltage. Operating Temperature : 0 - 70 ℃ Operating Temperature, 3,500MB/s Seq. Read, 3,200MB/s Seq. Write
Form Factor : M.2 (2280)
Available Capacity : up to 2TB
Designed for tech enthusiasts, hardcore gamers, and professionals who need unrivaled performance
Advanced Drive Management through Samsung Magician Software to help you manage the drive. A user friendly tools help keep your drive up to date, monitor drive health and speed, and even boost performance.
Warranty : 5 year limited
Manufacturer Detail: (1) Samsung Electronics Co., Ltd. Semiconductor Business Test & Package Center Address: #158 Baebang-Ro Baebang-Eup, Asan-city Chungcheongnam-Do, 31489 Republic of Korea (2) Samsung (China) Semiconductor Co. Ltd. Address: #1999 North Xiaohe Rd., Xinglong st., Chang'an District, Xi'an, Shaanxi Province, 710100 China
Packer Detail: (1) Samsung Electronics Co., Ltd. Semiconductor Business Test & Package Center Address: #158 Baebang-Ro Baebang-Eup, Asan-city Chungcheongnam-Do, 31489 Republic of Korea (2) Samsung (China) Semiconductor Co. Ltd. Address: #1999 North Xiaohe Rd., Xinglong st., Chang'an District, Xi'an, Shaanxi Province, 710100 China
Importer Details: Samsung Electronics Pvt.Ltd. Address: 6th Floor, DLF Centre, Sansad Marg, New Delhi-110001

About this item

Intel LGA 1700 Socket: Supports 13th and 12th Gen Intel Core Series Processors
DDR4 Compatible: Dual Channel DDR4, 4 DIMMs
Sturdy Power Design: 6+2+1 Hybrid Digital VRM Design
Comprehensive Thermal Design: M.2 Thermal Guard
Next Gen Connectivity: PCIe 4.0, NVMePCIe 4.0 x2 M.2, USB 3.2 Gen 2 Type-C
Fast Networking: 2.5GbE LAN, WiFi 6E
Fine Tuning Features: RGB FUSION 2.0, Supports Addressable LED & RGB LED Strips, Smart Fan 6, Q-Flash Plus Update BIOS without installing, CPU, Memory, and GPU

About this item

Impressive read/ write speeds up to 3500/3000MB/s
Spacious storage up to 4TB
Solid Gen3 performance. Micron Advanced 3D NAND. NVMe PCIe 3.0 M.2 (2280).
Performs up to 45% better than the previous generation⁴
Dynamic write acceleration. Multistep data integrity algorithm.

Brand	TP-Link
Hardware Interface	PCI
Colour	Black
Compatible Devices	Desktop
Product Dimensions	12.1L x 11.5W x 2.2H Centimeters
Data Link Protocol	IEEE 802.11ac, IEEE 802.11n
Data Transfer Rate	867 Megabits Per Second
Item Weight	0.13 Kilograms

Easy Installation – Plug the adapter into an available PCI-E slot to upgrade your desktop
High Speed Wi-Fi – Up to 1200 Mbps Wi-Fi speeds (867 Mbps on 5 GHz band and 300 Mpbs on 2.4 GHz band)
802.11ac Dual Band – 3 times faster than the 802.11n standard, perfect for high-intensity network usage
Beamforming – Wi-Fi signals are strengthened towards certain direction where client exists
Multiple-Size Brackets – Low profile and full heigh brackets are both provided, suitable for all PCs
2×2 MIMO – Users can easily access to high-speed wireless connection
Broad Wireless Range – Two external antennas ensure greater Wi-Fi coverage and enhanced stability

A heat sink helps to dissipate the thermal energy generated by the adapter, which in turn improves stability
Two external antennas utilize the latest wireless technology to achieve stable connections and boosted coverage
In an unlikely case of product quality related issue, we may ask you to reach out to brand’s customer service support and seek resolution. We will require brand proof of issue to process replacement request.

Content

Product description Processor support : Supports Intel i7/i5/i3/Pentium/Celeron processors in LGA1155 Chipset : Intel H61Chipset Memory support : 2 DDR3 dual-channel slots, Support DDR3 1066/1333/1600MHz memory LAN : Supports Realtek 8105E/8111E 100/1000 Mbps Audio : Realtek 662 3xAudio Jacks for 6 channel High definition audio Back panel : 1 PS/2 mouse/keyboard port, 1 VGA port, 1HDMI port, 4 USB 2.0 ports, 1 LAN port, 3 audio jacks On-Board connectors : 1 x Front panel connector, 1 x speaker connector, 1 x Front panel audio connector (2 x 5pin), 4 x USB 2.0 ports, 4 x SATA 3Gb/s (SATAII) ports, 1 x 4pin CPU fan connector, 1 x SYS fan connector, 1 x 24-pin ATX power connector, 1 x 4-pin ATX 12V power connector, 1 x 3pin clear CMOS header Slots : 1 PCI Express x16 slot, 1 PCI Express x1 slot

From the manufacturer

Always Evolving SSD

The ultimate in performance, upgraded. Faster than the 970 EVO, the 970 EVO Plus is powered by the latest V-NAND technology and firmware optimization. It maximizes the potential of NVMe bandwidth for unbeatable computing. In capacities up to 2TB, with reliability of up to 1,200 TBW.

Disclaimer-*1GB=1,000,000,000 bytes by IDEMA. A certain portion of capacity may be used for system file and maintenance use, so the actual capacity may differ from what is indicated on the product label. 3.3 V ± 5 % Allowable voltage.

Level up Performance

The 970 EVO Plus reaches sequential read/write speeds up to 3,500/3,300 MB/s, up to 53% faster than the 970 EVO. The latest V-NAND—which brings greater NAND performance and higher power efficiency—comes along with optimized firmware, a proven Phoenix controller, and Intelligent TurboWrite boost.

Disclaimer-*Performances may vary depending on SSD’s firmware version and system hardware & configuration. Performance measurements based on IOmeter 1.1.0. The write performances were measured with Intelligent TurboWrite technology being activated. The sequential write performances after Intelligent TurboWrite region are: 400 MB/s(250GB), 900 MB/s(500GB), 1,700 MB/s(1TB) and 1,750 MB/s(2TB). * Test system configuration: Intel Core i7-7700K CPU @4.2GHz, DDR4 2400MHz 32GB, OS-Windows 10 Built 10240, Chipset–ASUS PRIME Z270-A.

Exceptional Endurance

The new standard in sustainable performance. Get up to 1,200 TBW for lasting performance. The 970 EVO Plus provides exceptional endurance powered by the latest V-NAND technology and Samsung’s quality.

Disclaimer-* TBW: Terabytes Written*

Unparalleled Reliability

Achieve a new level of drive confidence. Samsung’s advanced nickel-coated controller and heat spreader on the 970 EVO Plus enable superior heat dissipation. The Dynamic Thermal Guard automatically monitors and maintains optimal operating temperatures to minimize performance drops.

Product description

Intel LGA 1700 Socket: Supports 13th and 12th Gen Intel Core Series Processors DDR4 Compatible: Dual Channel DDR4, 4 DIMMs Sturdy Power Design: 6+2+1 Hybrid Digital VRM Design Comprehensive Thermal Design: M.2 Thermal Guard Next Gen Connectivity: PCIe 4.0, NVMePCIe 4.0 x2 M.2, USB 3.2 Gen 2 Type-C Fast Networking: 2.5GbE LAN, WiFi 6E Fine Tuning Features: RGB FUSION 2.0, Supports Addressable LED & RGB LED Strips, Smart Fan 6, Q-Flash Plus Update BIOS without installing, CPU, Memory, and GPU. Enjoy unparalleled performance with the GIGABYTE B760M DS3H AX DDR4. The GIGABYTE B760M DS3H AX DDR4 supports 13th and 12th Gen Intel Core Processors. Unlock your gaming potential with GIGABYTE B760 Motherboards. GIGABYTE B760 motherboards come with upgraded power design, high grade storage standards, and outstanding connectivity that enables you to optimize your performance. Claim what is yours.

Brand	GIGABYTE
CPU Socket	LGA 1151
Compatible Devices	Personal Computer
RAM Memory Technology	DDR4
Compatible Processors	6th Generation Intel Core, 7th Generation Intel Core

Heat Sink for Ultimate Stability

A heat sink helps to dissipate the thermal energy generated by the adapter, which in turn improves stability. Additionally, lower temperatures help to extend the product lifespan.

External Antennas for More Targeted signal

Two external antennas utilize the latest wireless technology to achieve stable connections and boosted coverage.

Greater Coverage with Beamforming

Beamforming technology smartly focuses Wi-Fi signals towards connected devices for stable connections and boosted range.

802.11ac - Dual Band Wi-Fi for Faster Connections TP-LINK's Archer T4E supports the advanced Wi-Fi standard of IEEE 802.11ac, offering 3 times transferring rates as IEEE 802.11n. You can send emails and browse the web with 2.4GHz network, while keeping the speedy 5GHz band free for gaming, HD streaming and other bandwidth intensive applications. TP-LINK's Archer T4E supports the advanced Wi-Fi standard of IEEE 802.11ac, offering 3 times transferring rates as IEEE 802.11n. You can send emails and browse the web with 2.4GHz network, while keeping the speedy 5GHz band free for gaming, HD streaming and other bandwidth intensive applications. TP-LINK's Archer T4E supports the advanced Wi-Fi standard of IEEE 802.11ac, offering 3 times transferring rates as IEEE 802.11n. You can send emails and browse the web with 2.4GHz network, while keeping the speedy 5GHz band free for gaming, HD streaming and other bandwidth intensive applications.

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